Money Pours into New Fabs and Facilities

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil.

Looking ahead, artificial intelligence (AI), quantum computing, and data applications look set to leverage those investments as emerging technology draws interest from consumers and the markets.

See the Table below for over 100 notable chip industry facility/fab investments in 2023.

The semiconductor industry remains a global system


Companies continue to invest offshore even as various governments seek to build a home advantage. “In order to become totally independent of other countries or regions, it’s going to take a long time, and I don’t believe it’s what’s best for our industry or technology innovation,” said Ajit Manocha, president and CEO of SEMI. “Today, this is a very well interconnected system. We start with a substrate and we make a chip. For the substrate, most of the materials and chemicals are produced in Japan, with some in Europe and the U.S. The designs are mostly done in the U.S. The front-end manufacturing is mostly done in Taiwan and South Korea, and the assembly industry is in Southeast Asia. And then, final testing is in the U.S., and the distribution is from the U.S. So we are interdependent on six or seven regions in the world. To bring everything into the U.S. will create a lot of challenges. It will be time consuming to set up the entire ecosystem in one region, and it misses out on the advantages of specialization.”

SEMI expects 94 200mm and 300mm new fabs to come online between 2022 and 2026, 78 of which have begun operation, or are in the process of adding equipment or under construction. Of those, 63 are in Asia with 30 in China; 18 are in the U.S.; and 13 are in Europe and the Middle East, according to SEMI’s World Fab Forecast 3Q23. “There’s a full understanding across the board, whether it’s the U.S. or other countries, that it is a global industry, and we are dependent on and interdependent with multiple regions,” said Manocha. “We need to work in collaboration.”

In addition to the challenges of trying to set up an independent system, Manocha warns of the need to maintain international partners. “We need to create clear policies so we can work collectively with other regions. We don’t need to bring everything into one country, and we do need to make sure that we have enough redundancies in the system so that if unfortunate things like wars happen, we are not hostage to that situation.” Whether it’s fire, floods, or an ice storm in Texas, fabs are at risk from the elements. “The frequency of these calamities has increased and so we need multiple hubs in the semiconductor industry, not just the few hubs we have today,” he said. “That’s why I hope we can welcome India as a new hub, but there is a long way to go yet.”

India and Malaysia attracted almost a dozen investments in 2023. “Looking at it from a lens of the R&D landscape, there are attractive reasons to build in both of those regions,” said David Henshall, vice president of business development and government relations at  Semiconductor Research Corp. (SRC). “Many design companies have built centers there because there are large numbers of both undergraduate and graduate students, and the economics are favorable. And workforce development is an enormous issue so we’ve been working with India to address some of those needs. Some companies, and the Indian government, are looking at semiconductors as a way to help them grow their economy because of the research that’s done there and the talent that’s there.”

Among the key investments in India and Malaysia:

  • Synopsys is setting up a chip design center in Odisha, and opened a lab for virtual fab solutions in Mumbai, in partnership with IIT Bombay.
  • Micron’ $825 million investment in Gujarat, India, for DRAM and NAND assembly and test.
  • AMD’s $400 million R&D, design, and engineering investment in Bangalore and Karnataka, India.
  • Applied Materials’ $400 million in Bangalore, India, for a collaborative engineering center for manufacturing equipment.
  • Infineon made a total global investment of about $5.5 billion, some of which went into Kulim, Malaysia, to expand its 200mm SiC power fab.
  • Bosch invested about $376 million into Penang, Malaysia for auto test and sensors.

“We strategically focused on TCAD (technology computer-aided design) for the new Synopsys lab at IIT Bombay because of its critical, foundational role in advanced chip fabrication lifecycles,” said Aveek Sarkar, vice president of engineering, circuit design, and TCAD solutions at Synopsys. Students trained in the lab will acquire TCAD expertise to help solve the complex power, performance and area/cost challenges of manufacturing chips at the most advanced process nodes.

Government as a key player


National security is a major concern to certain governments, as evidenced by the U.S. banning the export of advanced chips to China, and China retaliating by banning the export of key minerals.

However, the primary concerns for the semiconductor industry are the talent shortage, climate threats, and supply chain issues. “These are three global challenges,” said Manocha. “No single company, no single country, and no single CEO can solve them. When I was in corporate life, I used to say, ‘Keep the government out of my business.’ But now I’m saying, ‘We need governments to be part of the business to solve these global challenges.’”

Selected government/industry investments:

  • Under the CHIPS Act, the U.S. Department of Commerce authorized $3 billion for advanced packaging, including a piloting facility.
  • BAE Systems received the first CHIPS Act funding award — an initial $35 million to modernize its Microelectronics Center and increase production of chips for fighter jets.
  • The U.S. Department of Defense awarded $35 million funding to GlobalFoundries for tools to produce at-scale 200mm GaN-on-Sic chips.
  • The EU and Belgium invested $1.6 billion in imec to expand its clean room test facility.
  • GF and ST’s €7.5 billion 300mm fab was funded by France and the EU Chips Act.
  • The Korean government is backing a semiconductor mega cluster in Yongin.
  • TSMC, Bosch, Infineon, and NXP’s $11 billion joint venture in Germany was planned under the framework of the EU Chips Act.

The U.S. CHIPS and Science Act of 2022 has a total budget of $280 billion, so there will be a slew of funding awards over the coming years. That includes a number of sub-categories, notably $52.7 billion under the CHIPS for America program, which is targeted at semiconductor manufacturing, R&D, and workforce development, and another $24 billion in tax credits for chip production.

“CHIPS for America is a historic effort to bring semiconductor manufacturing back to America and to support chipmakers build a robust ecosystem,” said Lora Weiss, director of the CHIPS Research & Development Office at the U.S. Department of Commerce, during an online launch of the advanced packaging program. “It will help to establish at least two new large-scale clusters of fabrication facilities for the leading-edge logic chips that drive advances in fields like artificial intelligence, biotech, and quantum computing. Instead of sending those chips overseas for packaging, where most of it takes place today, we envision that the United States will be home to multiple, high-volume advanced packaging facilities and become a global leader in advanced scale packaging for the most sophisticated chips.”

Packaging is fair game for innovation


“There is a revolution going on here, because we’re going away from these large monolithic chips to heterogeneous integration and different chiplets being packaged together,” said SRC’s Henshall. “Because this is new, there’s really no R&D infrastructure globally that exists. It’s a little bit of the Wild West right now, and so this is a great opportunity where the U.S. can do a bit more on-shoring. It’s a place for us to stay ahead on the technology front, and there’s a lot of opportunity due to the CHIPS Act and other things.”

Packaging also is undergoing a shift from round wafers to rectangular or square panels. “Panels are taking over effectively because you cannot handle the sizing of these new packages on wafers anymore,” said Keith Best, director of product marketing at Onto Innovation, citing TSMC’s 3D fabric and RDL interposers as an example. To help companies adapt to new technologies, Onto launched its Packaging Application Center of Excellence (PACE). “Customers are looking for help to define their next-node process, and they don’t have the time to take the production line down for R&D. It’s too complicated. So they are looking for proactive OEMs to help them speed up their learning and technology roadmaps.”

PACE houses Onto’s lithography steppers, inspection, and metrology tools, which are required to support the advanced packaging process development roadmaps of the OEMs and their customers. The plating, drilling, and other processes and operations will be provided by the other OEM partners at their facilities. “Each of the partners participating in the development efforts has a vested interest in being successful because they can help each other.”

Any country has a chance to establish itself as the global leader of advanced packaging right now, but the order may shift when the technology becomes the norm. “Countries will continue to offshore the things that have become routine,” said Best. “If you look at the history, the OSATs picked up processes that were given to them by the manufacturers of the packages from the U.S. to reduce costs. Now, there’s going to be an inflection point when the technology changes for advanced IC substrates to move to the next node. Those OSATs may not be able to deliver the yield and the pricing for new package designs that they did before, because the technology is beyond them. So if you have a new facility in the U.S. built specifically for advanced packages — that has the right cleanroom capability and the periphery technology to help them be successful at the next node — they could actually be pioneering and capture the market while it’s still hot. Then, after a period of time, advanced packaging will become a commodity and get pushed overseas again.”

Key packaging investments:

  • Amkor’s $2 billion into Arizona for advanced packaging.
  • TSMC’s $2.9 billion into Miaoli County, Taiwan, for advanced packaging.
  • Onto Innovation’s Packaging Applications Center of Excellence within its Massachusetts , USA headquarters.
  • JCET’s approximately $656 million for its auto advanced packaging factory in Shanghai, China.
  • Purdue University, Cadence, SRC, imec, and partners’ Institute for Advanced System Integration and Packaging (ASIP) in Indiana.
  • Resonac’s Packaging Solution Center (PSC) in California.

Advanced packaging is Moore’s Law 2.0, according to SEMI’s Manocha, because it’s the way that the continued scaling down is achievable. Onto’s Best agrees: “It’s not just the line width that’s important. It’s the package functionality. By combining chiplets into a heterogeneous integrated package, you can achieve greater functionality than you can in a monolithic chip.”

AI and other emerging tech drives demand


“You can see that we’re having a bit of a chip oversupply situation now, but this is purely due to the economic downturn trends,” said Manocha. “The reason I feel very bullish about the industry is because AI is definitely the big fuel that is going to keep growing.” Other market drivers Manocha listed were 5G, 6G, 7G, quantum computing, cryptocurrencies, and autonomous machines.

There also is a technology explosion in health care, automotive, and agriculture, as well as continued growth in social media and data centers. All of those require advanced chips.

“Everybody hears about AI and it’s a buzzword right now,” said SRC’s Henshall. “The reality is it’s been around for decades. But because of advances in chip technology and the speed now, it’s able to be much more useful than it ever was. And the popularity of generative AI is allowing more people to put money into research and development for chip hardware, which is really exciting for us. If you look at where R&D gets funded, it’s where the markets are. So we’ve got a portfolio of eight different programs that people can choose a la carte. And some programs are undernourished, like environmental health and safety. We need to grow that because we need a planet to make chips on. But the markets drive where the bigger budgets are.” The challenge, then, is to spread the funding around to other areas.

AI, quantum, and data investments:

  • Siemens’ $150 million investment in Dallas-Fort Worth production of infrastructure to help power U.S. data centers and accelerate adoption of AI.
  • Expedera’s engineering development center in the UK focused on edge AI inference.
  • NVIDIA, Jülich Supercomputing Centre, and ParTec’s quantum computing lab in Germany
  • TSMC’s reported 2nm fab in Taiwan’s Kaohsiung to catch the “AI wave.”
  • The U.S. Department of Energy’s Berkeley and Jefferson labs’ $300 million high performance data facility hub in Virginia.

By the numbers

So where is the money flowing? The following table lists prominent new facility/fab investments announced in 2023 and late 2022 since our last report ran, but there are many more beyond this list. Some items contain changes to previously announced plans. The table is currently presented alphabetically according to company or organization but it can also be sorted by country or other features.

Table

Company/DateAnnounced  Location  Investment  Type  Details 
Amkor


(Nov 23) 
USA:


Peoria, Ariz. 
$2B  Advanced packaging, test  Secured about 55 acres of land; clean room to be over 500,000 sq-ft; first client is Apple 
Air Liquide


(July 23) 
Taiwan & South Korea  Almost $200M  Advanced materials   Expected to start production in 2024 and 2025  
AMD


(Jul 23) 
India:


Bangalore, Karnataka 
$400M  R&D, design, engineering  500,000 sq-ft Bangalore campus will be one of 10 locations in India 
Analog Devices


(May 23) 
Ireland:


Limerick 
€630M euro (~$693.4)  Wafer production; R&D   45,000 sq-ft R&D and manufacturing facility 
Analog Devices


(Jul 23) 
USA:


Beaverton, Ore. 
Over $1B  Wafer fab on 180 nm technology node and above  Expand cleanroom space to about 118,000 sq-ft and nearly double manufacturing of 180-nm and above 
Ansys


(Jun 23) 
Rwanda:


Kigali 
Customer technical support office  Neighbor and partner with Carnegie Mellon University-Africa 
Applied Materials


(May 23)  
USA:


Santa Clara, Calif. 
Up to $4B over 7 years  Process technology and manufacturing equipment R&D    180,000 sq-ft EPIC Center 
Applied Materials


(Jun 23) 
India:


Bangalore 
Gross investment of $400M over 4 years  Collaborative engineering center for manufacturing equipment  Bring Applied’s engineers together with suppliers and academic institutions 
Applied Materials & Fraunhofer Photonics Institute


(Jul 23) 
Germany:


Dresden 
Not disclosed Metrology and process analysis  Located in the heart of Silicon Saxony 
Arizona State University, Applied Materials & Arizona Commerce Authority


(Jul 23) 
USA:


Tempe, Ariz.
Over $270M  Materials-to-Fab Center  Students and faculty use the same 300 mm equipment used in leading-edge fabs 
Applied Materials & CEA-Leti


(Dec 23) 
France:


Grenoble 
Not disclosed  Engineering solutions for specialty semiconductor applications  The joint lab features Applied Materials’ 200mm and 300mm wafer processing systems  
Asahi Kasei


(Dec 23)
Japan $105M Chip materials plant Double its production of liquid photosensitive resin
ASM


(Dec 23) 
USA:


Scottsdale, Ariz. 
€300M euro (~$323.8M)  Expansion of R&D site; pilot manufacturing  The center will cover 250,000 sq-ft (20,000 m²), more than double the size of the current facility 
ASML & Samsung


(Dec 23) 
South Korea  $760M  Next-gen EUV research plant  Part of a semiconductor alliance between South Korea and the Netherlands
ASML


(Nov 22) 
South Korea: Hwaseong  KRW240B won (~$182M)  Repair and training center   About 16,000 sq-m; completed by end of 2024 to serve Samsung and SK hynix 
ASML


(Aug 23) 
Taiwan:


New Taipei City 
$948.6M  EUV lithography tools for advanced 3 nm and 5 nm chips  3.3 hectares in the Linkou District; aims to start operation in 2026  
ASML


(Sept 23) 
Japan:


Hokkaido 
Not disclosed  An office to support the Rapidus plant  Currently has 8 sites in Japan and plans to grow its local workforce by 40% 
ASM


(Feb 23) 
South Korea:


Dongtan 
$100M multi-year  Expand its manufacturing and innovation center  Korea is a key site for ASM 
BOE Tech


(Jan 23) 
Vietnam  May total up to $400M  Manufacture remote control systems and displays  Two factories built by 2025 
Bosch


(Aug 23) 
Malaysia:


Penang 
About €350M euro (~$382M) through the mid-2030s  Final testing of its automotive chips and sensors  18,000 sq-m of clean rooms, offices, and Research and R&D labs 
Bosch & TSI


(Apr 23) 
USA:


Roseville, Calif. 
US $1.5B  Convert TSI manufacturing facilities to 200 mm SiC wafers  The full scope will depend on CHIPS Act and state funding 
Broadcom


(Jul 23)
Spain  Reported $1B  Large-scale back-end semiconductor facilities  Part of an EU-funded program to develop chip industry in Spain 
Brooks Instrum.


(Sept 23) 
Malaysia:


Penang 
Not disclosed  Manufacture mass flow controllers  57,000 sq-ft plant 
Bullen Ultrasonics


(Jan 23)
USA:


Eaton, Ohio 
$14M  Semiconductor manufacturing, aerospace composites, MEMS  Investment to expand its development center 
Changxin Xinqiao


(Oct 23) 
China:


Hefei, Anhui 
CN¥14.56B yuan (~$1.99B)  12-inch memory wafer  The first in China to mass produce integrated DRAM design, manufacturing 
Chem Trade


(Dec 22) 
USA:


Cairo, Ohio 
$50M  Expansion to UltraPure Sulphuric Acid facility  Planned to be open in 2024  
Coherent, DENSO & Mitsubishi Electric


(Oct 23) 
USA & Japan  Aggregate of $1B includes a supply agreement  SiC wafers and power electronics    DENSO, Mitsubishi each invest $500M for 12.5% equity in new SiC business   
EMD & Pennsylvania


(Apr 23) 
USA:


Hometown, Pa. 
$300M  Semiconductor manufacturing site   Create the world’s largest integrated Specialty Gases facility 
EMP Shield


(Feb 23)  
USA:


Burlington, Kan. 
$1.9B  Chip manufacturing  Located in Burlington’s Silicon Prairie Industrial Park 
Entegris


(Dec 22)  
USA:


Colorado Springs, Colo. 
$600M over several years  Produce critical products used to manufacture semiconductors  Targeted to begin initial commercial operations in mid-2024 
Expedera


(Jun 23) 
UK:


Bath 
Not disclosed  Edge AI inference  Engineering development center 
Fabric8 Labs


(Feb 23) 
USA:


San Diego 
$50M Series B investment round  Electrochemical additive manufacturing; pilot production facility  Investment round led by New Enterprise Associates  
Foxconn & STMicro


(Sept 23) 
India  Not disclosed  40 nm chip plant  The companies are said to be applying for state support 
Foxconn & Infineon


(May 23) 
Taiwan  Not disclosed  A system application center to support EV cooperation  Expected to be established within 2023 
Fraunhofer IPMS & Applied Materials


(Jul 23) 
Germany:


Dresden 
Not disclosed Metrology and process analysis Located in the heart of Silicon Saxony
GF & Amkor


(Feb 23) 
Portugal:


Porto 
Not disclosed  At-scale test and assembly services  Transfer GF’s 300 mm Bump and Sort lines from Dresden to Amkor’s Porto operations 
GF


(April 23) 
USA:


Malta, N.Y. 
Not disclosed  Secure, reliable U.S.-made chips  800 acres of additional land adjacent to its existing facility 
GF


(Sept 23) 
Malaysia:


Penang 
Not disclosed  Hub facility to support global operations  Will complement the recently opened GF Singapore fabrication plant 
GF


(Sept 23) 
Germany:


Dresden 
Potential $8B  Double capacity at its chipmaking plant   Seeking the same level of govt. support as TSMC 
GF & DoD


(Oct 23) 
USA:


Essex Junction, Vt. 
$35M  Move closer to at-scale 200 mm GaN-on-silicon chips  Buy tools to expand development and prototyping capabilities 
Hana Micron


(Sept 23) 
Vietnam:


Bac Giang Province 
More than $1B (~1.3 trillion won) by 2025  Expand to handle SK hynix’s packaging and testing volume  Has begun full-scale operation of its second factory in the province  
Hitachi


(Apr 23)  
Japan:


Kudamatsu, Yamaguchi 
¥24B yen (~$167.8M)   Etching systems   Opening in 2025, the site is about 80,000 sq-m and floor space is about 35,000 sq-m 
imec, EU & Belgium


(Jul 23) 
Belgium:


Leuven 
€1.5B euro (~$1.6B)  Expand its clean room test facility  Help de-risk the European supply chain 
Indiana University


(Oct 23) 
USA:


Bloomington, Ind. 
About $63.5M on facilities  Boost U.S. microelectronics; some defense applications  Partnered with NSWC Crane on some initiatives 
Infineon


(Aug 23)  
Malaysia:


Kulim 
Backed by customer commitments of €5B euro (~$5.5B)  200 mm SiC Power Fab  Expanding its existing Kulim fab 
Integra


(Feb 23) 
USA:


Bel Aire, Kan. 
Over $2B in 5 years  HQ and semiconductor production facility  A separate training facility to be in Wichita, Kan. 
Intel


(Jun 23) 
Poland:


Wrocław 
Up to $4.6B  Chip assembly and test facility  Design and planning to begin now; construction pending EU approval   
Intel


(Jun 23) 
Germany:


Magdeburg 
Increased investment from $17B to €30B euro (~$33B)  Wafer fab  Located in Silicon Junction  
Intel


(Oct 23) 
USA:


Hillsboro, Ore. 
Part of $100B 5-year U.S. plan  Upgrade at Gordon Moore Park campus; world’s first high-NA EUV lithography tool  Also applying for permits for future expansion of R&D and manufacturing capacity 
Intel


(June 23) 
Israel:


Kiryat Gat 
$25B, including $3.2B from the Israel govt. Chip manufacturing plant  It is said to be the largest ever investment by a company in Israel
Intel & Tower


(Sept 23) 
USA:


New Mexico 
Tower to invest up to $300M  300 mm manufacturing facility  Tower to use Intel’s manufacturing facility and acquire equipment and other assets  
JCET


(Nov 23) 
China:


Lingang, Shanghai 
RMB 4.8B (~$656M)  Advanced packaging for auto chips  Back-end base of over 130,000 sq-m with intelligent “lighthouse factory” area of about 200,000 sq-m; to be completed in 2025 
Kyocera


(Apr 23) 
Japan:


Nagasaki Prefecture 
About ¥62B yen (~$466M) based on plans through 2028  Fine ceramic components, semiconductor packages  About 150,000 sq-m facility; acquired about 37 acres for a new smart factory  
Linton Crystal Technologies


(Feb 23) 
USA:


Rochester, N.Y. 
$10M initial investment  Semiconductor and solar manufacturing equipment  Add a facility, establish demonstration line, build production capacity 
Menlo Microsystems


(Jul 23) 
USA:


Tompkins Co., NY 
$150M multi-year  Wafer production  The company’s first domestic production facility, estimated to begin in 2024 
Merck & M Chemicals


(Jan 23) 
Korea  Part of over €3B euro (~$3.3B) from 2021 to 2025  Acquired Mercaro’s chemical business  The acquisition is part of its Level Up growth program  
Merck


(Feb 23) 
Taiwan:


Kaohsiung 
Part of over €3B euro (~$3.3B) from 2021 to 2025  Specialty gases and semiconductor materials for thin film and patterning solutions  The site covers 150,000 sq-m  
Mersen USA


(Jun 23) 
USA:


Bay City & Greenville, Mich. 
$81.2M  Increase materials production capacity and product offerings  Will acquire 5 more acres at Bay City for 4 new buildings and 4 buildings will be rehabilitated; the Greenville location will expand 
Microchip


(Jul 23) 
India  $300M  Expand design operations; R&D  Improve Bangalore and Chennai facilities; new center in Hyderabad  
Microchip


(Feb 23) 
USA:


Colorado Springs, Colo. 
$880M  Expand SiC and Si production capacity; equipment for 8-inch wafers  The existing campus is about 50 acres 
Micron


(May 23) 
Japan:


Hiroshima 
Up to ¥500B yen (~$3.5B) over the next few years plus additional subsidies  Use EUV technology to manufacture next-gen DRAM, the 1-gamma (1γ) node  With support from the Japanese govt., aims to enable the next wave of end-to-end technology innovation  
Micron


(Jun 23) 
India:


Gujarat 
$825M over two phases  DRAM and NAND assembly and test facility  Phase 1 will include 500,000 sq-ft cleanroom to be operational late 2024; Phase 2 to start late 2020s 
Micron


(Jun 23) 
China:


Xian 
$603M  Chip packaging facility  Includes buying equipment from a Xian-based subsidiary of Taiwan’s Powertech Technology  
Micron


(Oct 23) 
Malaysia:


Penang 
Up to $1B expansion  Increase space of its new facility, equipment  Increase factory space to a total of 1.5M sq- ft 
Micronics


(May 23) 
Japan & South Korea ¥13.5B yen (~$93.8M) Testing equipment  Plan to have factories fully operational by August 2024 
Mitsubishi


(Mar 23) 
Japan:


Kumamoto  
¥260B yen (~$1.8B)  8-inch SiC wafers, and enhanced production facilities for 6-inch SiC wafers  Incorporate a facility in Shisui and introduce a clean room   
Mitsubish Chemical


(Sept 23)
Japan  Not disclosed  Semiconductor materials  New plant operational by around March 2025 
New York State & Partners


(Dec 23) 
USA:


Albany, N.Y. 
$10B combined investment  High NA EUV lithography  Located within NY CREATES’ Albany NanoTech Complex 
NHanced, Everspin, Trusted Semiconductor Solutions, Reliable MicroSystems


(Nov 22) 
USA:


Odon, Ind. 
Over $300M total  Semiconductor manufacturing hub   WestGate@Crane Technology Park is a 10-acre public-private development 
NHanced Semiconductors


(Dec 23)
USA:


Bloomington, Ind.
$152M Microelectronics manufacturing, packaging facility with cleanroom Requested 100% tax abatement from county govt.
NVIDIA, FZJ & ParTec AG


(May 23) 
Germany:


Jülich 
Not disclosed  Run high-performance and low-latency quantum-classical computing workloads  FZJ will host the lab as part of the Jülich Unified Infrastructure for Quantum Computing  
NXP & Austin Community College


(Dec 23) 
USA:


Austin, Texas 
Part of a $250K donation  Advanced manufacturing lab  The lab is co-located with an academy where students can work toward college credits while in high school 
On Semiconductor & 5 Others


(Apr 23)
South Korea  Total of $1.9B   Semiconductors, clean hydrogen, carbon neutrality  Plan to build production facilities in the future 
Onto Innovation


(Jul 23) 
USA:


Wilmington, Mass. 
Not disclosed  Panel-level packaging   A combined tool demonstrator, photo resist qualification, process integration and R&D facility  
Pallidus


(Feb 23) 
USA:


Rock Hill, S.C.  
$443M  Relocate its HQ and chip manufacturing operations  The facility is 300,000-sq-ft and expected to be online by Q3 2023 
Park Systems


(Sept 23) 
Korea:


Gwacheon and Yongin 
KRW 64.2B (~$47.4M) in Gwacheon  Atomic force microscopy (AFM) and nano-metrology  Expand HQ and facilities in Gwacheon in 2026; got premises in the Yongin Semiconductor Cluster 
Park Systems


(May 23) 
China:


Shanghai 
Not disclosed  Application center  Nearly 500 sq-m to provide tech support from pre-purchase research to after-sales  
Purdue University, Cadence & Partners


(Oct 23) 
USA:


West Lafayette, Ind. 
Not disclosed  Institute for Advanced System Integration and Packaging (ASIP)  Other partners include SRC, imec, Osaka University 
Purdue, imec & Indiana


(May 23) 
USA:


West Lafayette, Ind. 
Not disclosed  Nano- and digital technology innovation hub  Strengthen the US/EU semiconductor collaboration 
Renesas & Tata Consultancy Services


(Mar 23) 
India:


Bengaluru & Hyderabad 
Not disclosed  Chip designs and SW solutions    Unlock innovation and growth in Indian and emerging markets 
Resonac


(Nov 23) 
USA:


Silicon Valley, Calif. 
Not disclosed  Backend process R&D; Packaging Solution Center (PSC)  Plan to begin operation in 2025 after installing a clean room and equipment 
Rochester Institute of Technology


(Jan 23) 
USA:


Rochester, NY 
$2M  Upgrade its Semiconductor Fabrication Lab  Received $2M from the U.S. Dept. of Commerce  
Rogue Valley Microdevices


(Jun 23) 
USA:


Palm Bay, Fla. 
Not disclosed  MEMS fab  50,000 sq-ft building to serve as its second microfabrication facility 
ROHM


(July 23) 
Japan:


Miyazaki  
Not disclosed  SiC power devices  Acquired assets of Solar Frontier’s former Kunitomi Plant 
Samsung


(Mar 23)  
South Korea:


Yongin 
$228B over 20 years  Foundry chip production  Part of a govt.-backed semiconductor cluster 
Samsung


(May 23) 
Japan:


Yokohama 
¥30B yen (~$220M)  Potential development facility  Near Samsung R&D Institute Japan 
SBI Holdings & PSMC


(Oct 23) 
Japan:


Miyagi  
¥800B yen ($5.3B)  28nm, 40nm, and 55nm semis, with a targeted monthly output of 40,000 wafers  An MOU is based on receiving subsidy from Japanese govt. 
Seimetsu


(Jul 23) 
Japan:


Saitama 
Not disclosed  Wafer probing machines  Production capacity to increase by about 50% 
Siemens


(Jun 23) 
Singapore & China then EU & USA  Total of $2B  New factory in Singapore; expansion of digital factory in Chengdu  Global investment to expand leadership in digitalization, automation and sustainability 
Siemens


(Nov 23) 
USA:


Dallas-Fort Worth, Texas 
$150M  Electrical infrastructure to help power U.S. data centers and accelerate adoption of AI  Part of $500M U.S. investment and $2B global strategy 
Siemens Healthineers


(May 23)
Germany:


Forchheim 
€80M euro (~$84M)  Crystals for semiconductor production  A usable area of over 9,000 sq-m, scheduled to go into operation in 2026 
Silicon Box


(Jul 23) 
Singapore  $2B  Advanced semiconductor manufacturing foundry  73,000 sq-m facility delivers short interconnections using sub 5 micron technology 
SK hynix


(July 23) 
India  Not disclosed  Potential packaging facility  Currently evaluating India’s semiconductor manufacturing incentive scheme 
SkyWater & Vorago


(Jan 23) 
USA:


Bloomington, Minn.  
Not disclosed  Enhance SkyWater’s bulk 90 nm CMOS process  Vorago is moving its fabrication efforts to SkyWater’s U.S. foundry  
SkyWater


(Mar 23) 
USA:


Bloomington, Minn. 
Not disclosed  Cryogenic lab to characterize random telegraph signal noise for ROIC  Partnered with universities to develop test chips  
Sony


(Jun 23) 
Japan:


Kumamoto  
Not disclosed  Image sensor factory  The plant will be on a 270,000 sq-m site to be acquired  
Sony


(Nov 22) 
Thailand:


Pathum Thani 
$63.5M  Assembly of image sensors for automotive applications and display devices  Occupying 66,370 sq-m, targeted for completion by March 2024 and operations to begin first half of 2024 
ST & Sanan Optoelectronics


(Jun 23) 
China:


Chongqing 
$3.2B, including capital expenditures of about $2.4B over 5 years   200 mm SiC manufacturing plus a separate substrate manufacturing facility  The new SiC fab aims to start production in Q4 2025 with full build out by 2028 
STAr Technologies


(Jun 23) 
USA:


Phoenix, Ariz. 
Not disclosed  Probe card demo and potential test services center  Other facilities are in Taiwan, California, Arizona, Singapore, and China  
Sumco


(Jul 23) 
Japan:


Saga  
Up to ¥75B yen (~$529M) in subsidies  300 mm silicon wafers  Crystals to be produced in Imari City and processing to be in Yoshinogari town 
Synopsys & IIT Bombay


(Oct 23)
India:


Mumbai
Not disclosed Lab for virtual fab solutions with TCAD tools Research to evaluate next-gen materials, process technologies, devices
Synopsys & Partners


(Nov 23)
Vietnam:


Da Nang & Hanoi
Not disclosed Design incubation centers; research institute Signed MoUs with multiple government organizations
Synopsys


(Jul 23) 
India:


Bhubaneswar, Odisha 
Not disclosed  Chip design centre  Part of the O-Chip initiative to establish a next-gen Silicon Valley in Odisha 
TEL


(Mar 23) 
Japan:


Iwate  
About ¥22B yen (~$1.6B)  Thermal processing, deposition   Approx. 57,000 sq-m; completed fall 2025 
TI


(Feb 23) 
USA:


Lehi, Utah 
$11B  300 mm wafers  Once completed, TI’s two Lehi fabs will operate as a single fab; production is expected in 2026 
TI


(Jun 23) 
Malaysia:


Kuala Lumpur & Melaka 
Up to MYR9.6B (~$2.1B)  Assembly and test factory   Bought property next to existing factory in Kuala Lumpur; construction to start late 2023, with production to begin as early as 2025 
TI


(Aug 23) 
The Philippines:


Clark & Baguio  
$1B  Expansion existing chip manufacturing operations  Announced at the US-Asean Business Council meeting; part of “friendshoring”  
Toshiba


(Dec 22) 
Japan:


Hyogo  
Not disclosed  Discrete power semiconductors and small-signal devices  Construction to start June 2024; production scheduled for spring 2025 
TSMC


(Jun 23) 
Taiwan:


Hsinchu 
Not disclosed  TSMC-SoIC (System on Integrated Chips) process technology; 12-inch wafer   Located in Zhunan Science Park, the fab has a base area of 14.3 hectares, TSMC’s largest advanced backend fab to date 
TSMC


(Jul 23) 
Taiwan:


Miaoli County 
$2.9B  Advanced packaging fab  In the Tongluo Science Park, south of the firm’s main facilities in Hsinchu, near Taipei 
TSMC


(July 23) 
Taiwan:


Kaohsiung 
Not disclosed  Previously announced 7 nm & 28 nm chips, might now be 2 nm   Aims to catch the AI wave 
TSMC


(Dec 22) 
USA:


Phoenix, Ariz. 
Total for 2 Arizona fabs to be about US$40B  A second fab to focus on 3 nm process technology   Scheduled to begin production in 2026 but the first fab has seen delays 
TSMC, Bosch, Infineon & NXP


(Aug 23) 
Germany:


Dresden 
€10B euro (~$11B) total from equity injection, borrowing, and EU and German govts.   12-inch wafers on TSMC’s 28/22 nm planar CMOS and 16/12 nm FinFET process technology  TSMC committed €3.5B euro ($3.8B) for a 70% stake; Bosch, Infineon, and NXP hold 10% each 
TTM Technologies


(Nov 23) 
USA:


New York State 
Not disclosed  Ultra-high density interconnect PCBs to support national security requirements  At least as large as existing 160,000 sq-ft RF/microwave, microelectronics facility in Syracuse 
TÜV Rheinland North America


(Apr 23)
USA:


Boston, Mass. 
Not disclosed  Perform tests, certifications  65,000 sq-ft mix-use lab-office space 
UMC


(Mar 23) 
Taiwan:


Tainan 
$58.8M  Semiconductor manufacturing waste and recycling R&D center   Established at its flagship Fab 12A; expected to reduce 15,000 metric tons of waste annually 
UMC


(Mar 23) 
Singapore  $205.3M  Expand fab  L&K Engineering Suzhou landed the construction bid 
U.S. Dept. Of Commerce


(Nov 23) 
USA  $3B  To include an advanced packaging piloting facility  Advanced packaging manufacturing program funded under the CHIPS Act 
U.S. Dept. of Commerce


(Oct 23) 
USA  $10B for the program over 5 years  Chip manufacturing, quantum, and more  31 Tech Hubs received CHIPS Act funding in phase 1 of the hubs program 
U.S. Dept. Of Commerce & BAE Systems


(Dec 23) 
USA:


Nashua, N.H. 
$35M in initial funding  Includes defense-centric 6-inch GaAs and GaN HEMT wafers  CHIPS Act funding to modernize its Microelectronics Center (MEC) 
U.S. Dept. Of Defense


(Sept 23) 
USA  $238M  Prototype, manufacture, and produce at scale  8 Microelectronics Commons regional hubs received CHIPS Act funding 
U.S. Dept. Of Energy Labs


(Oct 23) 
USA:


Virginia
$300M to $500M High performance data; host mirrored centralized resources Jefferson Lab to lead joint project with Berkeley Lab
USI of ASE


(Jun 23)
Poland:


Kobierzyce 
Not disclosed  Its second chip factory in Poland  Expected to be operational by Q1 2024 
Vishay


(Sept 23) 
Mexico:


Gómez Palacio, Durango 
Not disclosed  Mass production of power inductors  18,000 sq-m, LEED v4-certified facility 
Wiwynn


(Nov 23) 
Taiwan:


Tainan 
NT$6.2B (~$192M)  PCBA manufacturing, accelerate product pilot run, NPI  Renting land from Southern Taiwan Science Park Bureau 
Wolfspeed & ZF


(May 23) 
Germany:


Nuremberg 
Not disclosed  R&D center to optimize SiC semiconductor tech  Construction to begin after funding approval   
Wolfspeed


(Feb 23) 
Germany:


Saarland 
Part of $6.5B capacity expansion   200 mm semiconductor fab  The 35-acre site is a former coal-fired power plant 
X-Fab


(May 23) 
USA:


Lubbock, Texas 
$200M   Expanding production of SiC semiconductors  Trying to grow capacity quickly  
Yale University


(Feb 23) 
USA:


New Haven, Conn. 
Not disclosed  Infrastructure for the School of Engineering & Applied Science  Address challenges including reliable AI 
Zeiss


(Mar 23) 
Germany:


Wetzlar 
Not disclosed  Optics, coating, assembly  Multifunctional factory to extend over 12,000 sq-mt 

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